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Low melting point solder preforms
Low melting point solder preforms
特点：
The solder alloys such as tin-bismuth, tin-indium and indium-silver are commonly used. Alloy designing and processing can be provided according to customer's needs.
产品介绍
产品信息
Solder preform with lower melting point than that of the tin-lead eutectic (183℃ ) is required for step soldering or low temperature assembly. The solder alloys such as tin-bismuth, tin-indium and indium-silver are commonly used. Alloy designing and processing can be provided according to customer's needs. When soldering at low temperature, low melting point alloys often need to be matched with special flux for low temperature. Otherwise, it may cause ineffective fluxing and pseudo soldering if applying normal flux. It is recommended to use flux-coated low melting point solder.
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